International Journal of Research and Development in Engineering Sciences https://www.ijrdes.com M.SIVA KUMAR 7 5 (September - October) 2025 10 September-October en3D ICThermal through silicon Noise CouplingHeat sourceCNTFIN. Through TTSV One of the emerging technologies that is wellsuited to CMOS implementations is 3D IC integration which entails vertically stacking many IC layers Through Silicon Vias TSVs and CuCu bonding are used to physically and electrically connect the IC layers of a 3D IC Important restrictions in 3D IC designs that have a significant effect on overall system performance are thermal issues between layers and noise coupling between TSVtosubstrate and TSVtoTSV Heat spreaders and thermal through silicon vias TTSVs play crucial roles in 3D IC integration The failure of an integrated circuit IC is often caused by excessive heat building up in one area however heat spreaders and FIN to TTSV have been proposed as solutions in recent years When a voltage is applied to a threedimensional integrated circuit 3D IC the temperature of the IC rises potentially resulting in the ICs failure To mitigate this risk engineers have added fin to the TTSV using a variety of strategies each of which optimizes the heat dissipation in a different direction Both carbon Nanotubes CNTs and Graphene which are used for their excellent thermal cooling properties are widely disseminated Using ideal orientations and heat spreaders this study demonstrates a FIN that effectively disperses heat in all directions and transfers thermal energy to a heat sink We also showed how different thermal cooling effects affect the ICs potential distribution in different circumstances Based on our findings Carbon Nanotubes CNTs are more effective than Graphene in dissipating heat away from both heat sources and TSVs We tested the effects of changing the dielectric properties of the model by including Al2o3 Si3N4 and SiO2 as examples Copyright (c) 2026 International Journal of Research and Development in Engineering Sciences. All rights reserved. 2025 All Rights Reserved