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This paper proposes a novel technique for reducing crossover disturbances, consumption of electricity, Power Delay Product (PDP), and Energy-Delay Product (EDP) in MWCNT-based through-silicon vias (TSVs) with polymer dielectric liners. A new TSV structure is introduced, which uses MWCNT bundles as conductive elements and polymer liners such as polyimide, Polypropylene Carbonate (PPC), and Benzo Cyclobutene (BCB) as insulators. An analogous electrical circuit model is developed to assess crosstalk effects in connected TSVs powered by a ternary inverter. Simulations with the HSPICE tool show that BCB-based TSVs significantly improve performance, especially at lower TSV heights, by up to 30.21% over single-walled carbon nanotube (SWCNT) TSVs. Additionally, BCB-lined TSVs exhibit superior crosstalk suppression, especially at larger TSV pitch values, with a 40.03% enhancement at 0.5 to 3 μm pitch compared to SWCNT TSVs. The study further explores the impact of TSV height and dielectric constant variations, revealing that BCB provides a 43.8% reduction in crosstalk delay over conventional SiO₂ liners. These findings highlight the potential of polymer liners, particularly BCB, in improving signal integrity and overall performance in next-generation 3D ICs, making them a promising alternative to traditional materials.
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Tappeta Chinna Sanjeeva Rayudu received his B.Tech degree in Electronics and Communication Engineering from JNTU Anantapuram, Andhra Pradesh, India in 2009. He completed his M.Tech at JNTU Anantapuram, Andhra Pradesh, India in 2011 and is currently pursuing a Ph.D. in the Department of Electronics and Communication Engineering at Annamacharya University, Rajampet, Andhra Pradesh, India.""""""
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*Corresponding Author: T Chinna Sanjeeva Rayudu, tappetasanjeev@gmail.com
Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.
Conflict of interest: The author declares that the research was conducted in the absence of any commercial or financial relationships that could be construed as a potential conflict of interest.
Publisher’s note: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article, or claim that may be made by its manufacturer, is not guaranteed or endorsed by the publisher.
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